分类:
RAM芯片(267)
品牌:
Swissbit(18)
Samsung (三星)(11)
Micron (镁光)(72)
Epson Electronics (爱普生)(1)
LG (乐金电子)(1)
Mitsubishi (三菱)(1)
Cypress Semiconductor (赛普拉斯)(38)
Lapis Semiconductor(3)
TI (德州仪器)(1)
Renesas Electronics (瑞萨电子)(25)
GSI(26)
Toshiba (东芝)(4)
Integrated Device Technology (艾迪悌)(10)
Qimonda (奇梦达)(3)
Apacer (宇瞻)(1)
Alliance Memory (联盟记忆)(1)
Lyontek(2)
NEC (日本电气)(1)
SanDisk (闪迪)(20)
BSI(1)
Elpida (尔必达)(1)
Winbond Electronics (华邦电子股份)(5)
Advantech (研华)(1)
Microsemi (美高森美)(1)
Virtium Technology(3)
ST Microelectronics (意法半导体)(1)
SK Hynix (海力士)(1)
Harris(1)
Integrated Silicon Solution(ISSI)(1)
AMIC Technology (联笙电子)(1)
Kingston (金士顿)(7)
Epcos (爱普科斯)(1)
HITACHI (日立)(1)
Wintec(2)
多选
封装:
(70)
TSOP(28)
DIP(2)
SOJ(11)
TQFP(8)
TSOP-54(5)
TSOP-2(9)
FBGA(19)
RDIMM-240(2)
FBGA-78(4)
TBGA-168(1)
VFBGA-168(2)
BGA-60(1)
VFBGA-90(2)
TSOP-66(2)
BGA(6)
TSOP-44(2)
FBGA-92(1)
TQFP-100(3)
TFBGA-60(3)
Surface Mount(6)
VFBGA-60(1)
54(2)
134(1)
FBGA-168(1)
VFBGA(2)
60(2)
TSSOP-66(2)
144(2)
8(1)
TBGA(1)
FBGA-60(2)
PGA-68(1)
FBGA-84(1)
UDIMM-288(1)
86(1)
SOP(10)
Through Hole(2)
TSSOP(1)
TFBGA(3)
100(2)
LQFP-100(1)
CDIP(3)
PLCC(1)
SOIC(3)
LQFP(3)
66(1)
165(5)
Not Required(1)
VFBGA-100(1)
QFP(3)
48(1)
TSOP1-R(1)
TSOP1(1)
SOP-32(4)
LQFP-128(1)
SOP-28(1)
QCCN(1)
BGA-119(1)
TSOP-32(1)
LBGA(1)
240(1)
MODULE(1)
32(1)
28(2)
VFBGA-134(1)
多选
包装:
(160)
Bulk(12)
Tray(48)
Tape & Reel (TR)(22)
Tray, Bulk(2)
Cut Tape (CT), Tape & Reel (TR)(3)
Tape, Tape & Reel (TR)(2)
Cut Tape (CT)(3)
Tube(8)
Each(3)
Tape(1)
INDIVIDUAL(3)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料

©Copyright 2013-2025 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空