品牌:
TE Connectivity (泰科)(36)
Samtec (申泰电子)(364)
Molex (莫仕)(15)
Preci-Dip Durtal Sa(5)
Weidmuller (魏德米勒)(6)
3M(2)
FCI Electronics (法马通)(36)
Kyocera (京瓷)(2)
Harwin(1)
Amphenol (安费诺)(33)
多选
封装:
-(10)
Solder(245)
Surface Mount(32)
Through Hole(153)
(46)
6(2)
PCB(2)
29(1)
Board(1)
8(2)
throughHole(3)
2.54 mm(3)
多选
包装:
Box(5)
Bulk(230)
Tape & Reel (TR)(43)
(175)
-(1)
Tube(33)
Tray(11)
Tape(1)
Bag(1)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded20电路,锡(Sn )电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded20 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
    2412
    5-49
    23.9148
    50-199
    22.8928
    200-499
    22.3205
    500-999
    22.1774
    1000-2499
    22.0343
    2500-4999
    21.8708
    5000-7499
    21.7686
    ≥7500
    21.6664
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded40电路, 0.76μm ( 30μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    7797
    1-9
    97.4280
    10-99
    93.1920
    100-249
    92.4295
    250-499
    91.8365
    500-999
    90.9046
    1000-2499
    90.4810
    2500-4999
    89.8879
    ≥5000
    89.3796
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直,带罩, 6Circuits , 0.76μm ( 30μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 6Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    5443
    5-49
    34.8777
    50-199
    33.3872
    200-499
    32.5525
    500-999
    32.3439
    1000-2499
    32.1352
    2500-4999
    31.8967
    5000-7499
    31.7477
    ≥7500
    31.5986
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,缭绕, 8电路, 0.76米( 30” ) 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 8 Circuits, 0.76m (30")
    6826
    1-9
    38.4178
    10-99
    36.2135
    100-249
    34.5760
    250-499
    34.3241
    500-999
    34.0722
    1000-2499
    33.7888
    2500-4999
    33.5369
    ≥5000
    33.3794
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded50电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded50 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    2853
    1-9
    77.7400
    10-99
    74.3600
    100-249
    73.7516
    250-499
    73.2784
    500-999
    72.5348
    1000-2499
    72.1968
    2500-4999
    71.7236
    ≥5000
    71.3180
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded24电路,锡(Sn )镀层,用压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded24 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
    8640
    1-9
    42.7244
    10-99
    40.2730
    100-249
    38.4520
    250-499
    38.1718
    500-999
    37.8916
    1000-2499
    37.5765
    2500-4999
    37.2963
    ≥5000
    37.1212
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,罩, 6电路,锡(Sn )镀层,用压入塑料钉 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 6 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
    2239
    5-49
    18.5328
    50-199
    17.7408
    200-499
    17.2973
    500-999
    17.1864
    1000-2499
    17.0755
    2500-4999
    16.9488
    5000-7499
    16.8696
    ≥7500
    16.7904
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded20电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    4690
    5-49
    32.6664
    50-199
    31.2704
    200-499
    30.4886
    500-999
    30.2932
    1000-2499
    30.0978
    2500-4999
    29.8744
    5000-7499
    29.7348
    ≥7500
    29.5952
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,罩, 14电路, 0.38米 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 14 Circuits, 0.38m
    2834
    1-9
    40.5772
    10-99
    38.2490
    100-249
    36.5195
    250-499
    36.2534
    500-999
    35.9873
    1000-2499
    35.6880
    2500-4999
    35.4219
    ≥5000
    35.2556
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,罩, 26电路, 0.38米 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 26 Circuits, 0.38m
    6611
    1-9
    58.6698
    10-99
    55.3035
    100-249
    52.8028
    250-499
    52.4181
    500-999
    52.0334
    1000-2499
    51.6006
    2500-4999
    51.2159
    ≥5000
    50.9754
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded10电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded10 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    4709
    5-49
    30.4785
    50-199
    29.1760
    200-499
    28.4466
    500-999
    28.2643
    1000-2499
    28.0819
    2500-4999
    27.8735
    5000-7499
    27.7433
    ≥7500
    27.6130
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,罩, 16电路,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 16 Circuits, Tin (Sn) Plating
    6224
    1-9
    39.2596
    10-99
    37.0070
    100-249
    35.3336
    250-499
    35.0762
    500-999
    34.8188
    1000-2499
    34.5291
    2500-4999
    34.2717
    ≥5000
    34.1108
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直,带罩, 6Circuits ,锡(Sn )电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 6Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
    4840
    5-49
    26.4069
    50-199
    25.2784
    200-499
    24.6464
    500-999
    24.4885
    1000-2499
    24.3305
    2500-4999
    24.1499
    5000-7499
    24.0371
    ≥7500
    23.9242
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: Conn Shrouded Header HDR 10POS 2.54mm Solder ST Thru-Hole Tube
    4759
    5-49
    15.4908
    50-199
    14.8288
    200-499
    14.4581
    500-999
    14.3654
    1000-2499
    14.2727
    2500-4999
    14.1668
    5000-7499
    14.1006
    ≥7500
    14.0344
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”口袋,带罩,带压入塑料钉, 8电路, 0.76μm ( 30μ “),金(Au )选择性电镀,锡( Sn)的PC端脚镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
    8682
    5-49
    19.9017
    50-199
    19.0512
    200-499
    18.5749
    500-999
    18.4559
    1000-2499
    18.3368
    2500-4999
    18.2007
    5000-7499
    18.1157
    ≥7500
    18.0306
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”掌上, Shroudedwith压入塑料栓, 16电路, 0.76μm ( 30μ “),金(Au )选择性电镀,锡 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 16 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin
    4670
    5-49
    33.9534
    50-199
    32.5024
    200-499
    31.6898
    500-999
    31.4867
    1000-2499
    31.2836
    2500-4999
    31.0514
    5000-7499
    30.9063
    ≥7500
    30.7612
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”掌上, Shroudedwith压入塑料栓, 20电路, 0.38μm ( 15μ “),金(Au )选择性电镀,锡 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin
    1980
    1-9
    66.2055
    10-99
    63.3270
    100-249
    62.8089
    250-499
    62.4059
    500-999
    61.7726
    1000-2499
    61.4848
    2500-4999
    61.0818
    ≥5000
    60.7364
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”口袋,带罩,带压入塑料钉, 5电路, 0.38μm ( 15μ “),金(Au )选择性电镀,锡( Sn)的PC端脚镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded,with Press-fit Plastic Peg, 5 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin(Sn) PC Tail Plating
    8881
    10-99
    10.9680
    100-499
    10.4196
    500-999
    10.0540
    1000-1999
    10.0357
    2000-4999
    9.9626
    5000-7499
    9.8712
    7500-9999
    9.7981
    ≥10000
    9.7615
  • 描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”口袋,带罩,带压入塑料栓, 21电路,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded,with Press-fit Plastic Peg, 21 Circuits, Tin (Sn) Plating
    6232
    5-49
    22.6395
    50-199
    21.6720
    200-499
    21.1302
    500-999
    20.9948
    1000-2499
    20.8593
    2500-4999
    20.7045
    5000-7499
    20.6078
    ≥7500
    20.5110
  • 描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”掌上, Shroudedwith压入塑料钉, 4个电路, 0.38μm ( 15μ “),金(Au )选择性电镀,锡 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 4 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin
    7902
    10-99
    6.2280
    100-499
    5.9166
    500-999
    5.7090
    1000-1999
    5.6986
    2000-4999
    5.6571
    5000-7499
    5.6052
    7500-9999
    5.5637
    ≥10000
    5.5429
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ” PocketShrouded , 20电路,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" PocketShrouded, 20 Circuits, Tin (Sn) Plating
    7130
    5-49
    33.0876
    50-199
    31.6736
    200-499
    30.8818
    500-999
    30.6838
    1000-2499
    30.4858
    2500-4999
    30.2596
    5000-7499
    30.1182
    ≥7500
    29.9768
  • 描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ” PocketShrouded , 7电路, 0.76μm ( 30μ “),金(Au )选择性电镀,锡(Sn ) PC尾 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" PocketShrouded, 7 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail
    4712
    10-99
    11.5560
    100-499
    10.9782
    500-999
    10.5930
    1000-1999
    10.5737
    2000-4999
    10.4967
    5000-7499
    10.4004
    7500-9999
    10.3234
    ≥10000
    10.2848
  • 描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ” PocketShrouded , 9电路, 0.76μm ( 30μ “),金(Au )选择性电镀,锡(Sn ) PC尾 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" PocketShrouded, 9 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail
    4679
    5-49
    15.7248
    50-199
    15.0528
    200-499
    14.6765
    500-999
    14.5824
    1000-2499
    14.4883
    2500-4999
    14.3808
    5000-7499
    14.3136
    ≥7500
    14.2464
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ”口袋,带罩, 4回路,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" Pocket,Shrouded, 4 Circuits, Tin (Sn) Plating
    2087
    5-24
    5.4945
    25-49
    5.0875
    50-99
    4.8026
    100-499
    4.6805
    500-2499
    4.5991
    2500-4999
    4.4974
    5000-9999
    4.4567
    ≥10000
    4.3956
  • 描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ” PocketShrouded , 13电路, 0.76μm ( 30μ “),金(Au )选择性电镀,锡(Sn ) PC尾 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" PocketShrouded, 13 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail
    3123
    5-49
    24.2073
    50-199
    23.1728
    200-499
    22.5935
    500-999
    22.4487
    1000-2499
    22.3038
    2500-4999
    22.1383
    5000-7499
    22.0349
    ≥7500
    21.9314
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ” PocketShrouded , 19电路,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" PocketShrouded, 19 Circuits, Tin (Sn) Plating
    2900
    1-9
    41.2360
    10-99
    38.8700
    100-249
    37.1124
    250-499
    36.8420
    500-999
    36.5716
    1000-2499
    36.2674
    2500-4999
    35.9970
    ≥5000
    35.8280
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL头,低调,单列,直角, 0.120 ”口袋,带罩,电路22 2.54mm (.100") Pitch SL Header, Low Profile, Single Row, Right Angle, .120" Pocket, Shrouded, 22 Circuits
    4204
    1-9
    44.2494
    10-99
    41.7105
    100-249
    39.8245
    250-499
    39.5343
    500-999
    39.2441
    1000-2499
    38.9177
    2500-4999
    38.6276
    ≥5000
    38.4462
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ”口袋,带罩, 23电路,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" Pocket, Shrouded, 23 Circuits, Tin (Sn) Plating
    8149
    1-9
    44.8838
    10-99
    42.3085
    100-249
    40.3954
    250-499
    40.1011
    500-999
    39.8068
    1000-2499
    39.4757
    2500-4999
    39.1814
    ≥5000
    38.9974
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ” PocketShrouded , 16电路,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" PocketShrouded, 16 Circuits, Tin (Sn) Plating
    1113
    5-49
    29.8584
    50-199
    28.5824
    200-499
    27.8678
    500-999
    27.6892
    1000-2499
    27.5106
    2500-4999
    27.3064
    5000-7499
    27.1788
    ≥7500
    27.0512
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™接头,低调,单列,直角, 0.120 ” PocketShrouded , 2电路, 0.76μm ( 30μ “),金(Au )选择性电镀,锡(Sn ) PC尾 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" PocketShrouded, 2 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail
    1480
    10-99
    7.3200
    100-499
    6.9540
    500-999
    6.7100
    1000-1999
    6.6978
    2000-4999
    6.6490
    5000-7499
    6.5880
    7500-9999
    6.5392
    ≥10000
    6.5148

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