品牌:
TE Connectivity (泰科)(36)
Samtec (申泰电子)(364)
Molex (莫仕)(15)
Preci-Dip Durtal Sa(5)
Weidmuller (魏德米勒)(6)
3M(2)
FCI Electronics (法马通)(36)
Kyocera (京瓷)(2)
Harwin(1)
Amphenol (安费诺)(33)
多选
封装:
-(10)
Solder(245)
Surface Mount(32)
Through Hole(153)
(46)
6(2)
PCB(2)
29(1)
Board(1)
8(2)
throughHole(3)
2.54 mm(3)
多选
包装:
Box(5)
Bulk(230)
Tape & Reel (TR)(43)
(175)
-(1)
Tube(33)
Tray(11)
Tape(1)
Bag(1)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,直角,通孔, 16电路, 0.38μm ( 15μ ),金(Au )选择性电镀,托盘,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Through Hole, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
    8172
    5-24
    6.1425
    25-49
    5.6875
    50-99
    5.3690
    100-499
    5.2325
    500-2499
    5.1415
    2500-4999
    5.0278
    5000-9999
    4.9823
    ≥10000
    4.9140
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,直角,通孔, 18电路, 0.38μm ( 15μ ),金(Au )选择性电镀,托盘,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
    3426
    10-99
    6.1440
    100-499
    5.8368
    500-999
    5.6320
    1000-1999
    5.6218
    2000-4999
    5.5808
    5000-7499
    5.5296
    7500-9999
    5.4886
    ≥10000
    5.4682
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,直角,通孔, 50电路, 0.38μm ( 15μ ),金(Au )选择性电镀,托盘,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Through Hole, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
    1833
    5-49
    20.2761
    50-199
    19.4096
    200-499
    18.9244
    500-999
    18.8031
    1000-2499
    18.6817
    2500-4999
    18.5431
    5000-7499
    18.4565
    ≥7500
    18.3698
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,直角,通孔, 30电路, 0.38μm ( 15μ ),金(Au )选择性电镀,托盘,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Through Hole, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
    2630
    10-99
    11.5200
    100-499
    10.9440
    500-999
    10.5600
    1000-1999
    10.5408
    2000-4999
    10.4640
    5000-7499
    10.3680
    7500-9999
    10.2912
    ≥10000
    10.2528
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,直角,通孔, 6号线路, 0.38μm ( 15μ ),金(Au )选择性电镀,托盘,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Through Hole, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
    7770
    5-24
    2.6460
    25-49
    2.4500
    50-99
    2.3128
    100-499
    2.2540
    500-2499
    2.2148
    2500-4999
    2.1658
    5000-9999
    2.1462
    ≥10000
    2.1168
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: Conn Unshrouded Header HDR 26POS 2mm Solder ST SMD T/R
    2713
    5-49
    12.3318
    50-199
    11.8048
    200-499
    11.5097
    500-999
    11.4359
    1000-2499
    11.3621
    2500-4999
    11.2778
    5000-7499
    11.2251
    ≥7500
    11.1724
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,直角,通孔, 10电路, 0.38μm ( 15μ ),金(Au )选择性电镀,托盘,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
    9260
    5-24
    5.1165
    25-49
    4.7375
    50-99
    4.4722
    100-499
    4.3585
    500-2499
    4.2827
    2500-4999
    4.1880
    5000-9999
    4.1501
    ≥10000
    4.0932
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 44电路, 0.38μm ( 15μ ),金(Au )选择性电镀,用压接塑料钉,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free
    3202
    5-49
    24.3945
    50-199
    23.3520
    200-499
    22.7682
    500-999
    22.6223
    1000-2499
    22.4763
    2500-4999
    22.3095
    5000-7499
    22.2053
    ≥7500
    22.1010
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 34电路, 0.38μm ( 15μ ),金(Au )选择性电镀,无压入塑料钉,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
    6081
    5-49
    27.7758
    50-199
    26.5888
    200-499
    25.9241
    500-999
    25.7579
    1000-2499
    25.5917
    2500-4999
    25.4018
    5000-7499
    25.2831
    ≥7500
    25.1644
  • 描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,通孔,垂直, 40电路, 0.76μm ( 30μ ),金(Au )选择性电镀,掌上纸盒包装,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
    8861
    5-49
    13.7475
    50-199
    13.1600
    200-499
    12.8310
    500-999
    12.7488
    1000-2499
    12.6665
    2500-4999
    12.5725
    5000-7499
    12.5138
    ≥7500
    12.4550
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 28电路, 0.38μm ( 15μ ),金(Au )选择性电镀,有挑选和放置盖,磁带和卷轴包装 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
    7225
    5-49
    21.8790
    50-199
    20.9440
    200-499
    20.4204
    500-999
    20.2895
    1000-2499
    20.1586
    2500-4999
    20.0090
    5000-7499
    19.9155
    ≥7500
    19.8220
  • 描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 22电路, 0.38μm ( 15μ ),金(Au )选择性电镀,无压入塑料钉,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
    5400
    5-49
    13.1625
    50-199
    12.6000
    200-499
    12.2850
    500-999
    12.2063
    1000-2499
    12.1275
    2500-4999
    12.0375
    5000-7499
    11.9813
    ≥7500
    11.9250
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 16电路, 0.38μm ( 30μ ),金(Au )选择性电镀,用压接塑料钉,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free
    4493
    10-99
    10.0200
    100-499
    9.5190
    500-999
    9.1850
    1000-1999
    9.1683
    2000-4999
    9.1015
    5000-7499
    9.0180
    7500-9999
    8.9512
    ≥10000
    8.9178
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 16电路, 0.76μm ( 30μ ),金(Au )选择性电镀,无压入塑料钉,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
    5770
    5-49
    15.8652
    50-199
    15.1872
    200-499
    14.8075
    500-999
    14.7126
    1000-2499
    14.6177
    2500-4999
    14.5092
    5000-7499
    14.4414
    ≥7500
    14.3736
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 14电路, 0.76μm ( 30μ ),金(Au )选择性电镀,无压入塑料钉 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    3103
    5-49
    15.0930
    50-199
    14.4480
    200-499
    14.0868
    500-999
    13.9965
    1000-2499
    13.9062
    2500-4999
    13.8030
    5000-7499
    13.7385
    ≥7500
    13.6740
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 16电路, 0.38μm ( 15μ ),金(Au )选择性电镀,无压入塑料钉,拾取 - 放置盖 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
    3231
    10-99
    11.9760
    100-499
    11.3772
    500-999
    10.9780
    1000-1999
    10.9580
    2000-4999
    10.8782
    5000-7499
    10.7784
    7500-9999
    10.6986
    ≥10000
    10.6586
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 8电路, 0.76μm ( 30μ ),金(Au )选择性电镀,无压入塑料钉 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    7300
    10-99
    8.0760
    100-499
    7.6722
    500-999
    7.4030
    1000-1999
    7.3895
    2000-4999
    7.3357
    5000-7499
    7.2684
    7500-9999
    7.2146
    ≥10000
    7.1876
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 ( 15μ帽,磁带和卷轴包装,无铅 2.00mm (.079 (15μ Cap, Tape and Reel Packaging, Lead-free
    3169
    10-99
    7.1400
    100-499
    6.7830
    500-999
    6.5450
    1000-1999
    6.5331
    2000-4999
    6.4855
    5000-7499
    6.4260
    7500-9999
    6.3784
    ≥10000
    6.3546
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,通孔,垂直, 46电路, 0.38μm ( 15μ ),金(Au )选择性电镀,纸盒包装,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
    2036
    10-99
    11.9520
    100-499
    11.3544
    500-999
    10.9560
    1000-1999
    10.9361
    2000-4999
    10.8564
    5000-7499
    10.7568
    7500-9999
    10.6771
    ≥10000
    10.6373
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( .079 “ )间距的Milli-电网™接头,通孔,垂直, 42电路, 0.76μm ( 30μ ”),金(Au )选择性电镀,掌上纸盒包装,无铅 2.00mm (.079") Pitch Milli-Grid™ Header, Through Hole, Vertical, 42 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
    1726
    5-49
    11.8287
    50-199
    11.3232
    200-499
    11.0401
    500-999
    10.9694
    1000-2499
    10.8986
    2500-4999
    10.8177
    5000-7499
    10.7672
    ≥7500
    10.7166
  • 描述: 2.00毫米( .079 “ )间距的Milli-电网™接头,通孔,垂直, 24电路, 0.38μm 15μ ”),金(Au )选择性电镀,掌上纸盒包装,无铅 2.00mm (.079") Pitch Milli-Grid™ Header, Through Hole, Vertical, 24 Circuits, 0.38μm 15μ") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
    9936
    10-99
    9.3720
    100-499
    8.9034
    500-999
    8.5910
    1000-1999
    8.5754
    2000-4999
    8.5129
    5000-7499
    8.4348
    7500-9999
    8.3723
    ≥10000
    8.3411
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: Conn Shrouded Header HDR 14POS 2mm Solder ST Thru-Hole Tray
    9098
    5-24
    6.5880
    25-49
    6.1000
    50-99
    5.7584
    100-499
    5.6120
    500-2499
    5.5144
    2500-4999
    5.3924
    5000-9999
    5.3436
    ≥10000
    5.2704
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( .079 “ )间距的Milli-电网™接头,通孔,垂直, 6电路, 0.76μm ( 30μ ”),金(Au )选择性电镀,掌上纸盒包装,无铅 2.00mm (.079") Pitch Milli-Grid™ Header, Through Hole, Vertical, 6 Circuits, 0.76μm(30μ") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
    2627
    5-24
    3.2805
    25-49
    3.0375
    50-99
    2.8674
    100-499
    2.7945
    500-2499
    2.7459
    2500-4999
    2.6852
    5000-9999
    2.6609
    ≥10000
    2.6244
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,通孔,垂直, 6电路, 0.38μm ( 15μ “),金(Au )选择性电镀,掌上纸盒包装,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, 6 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
    5919
    5-24
    2.9565
    25-49
    2.7375
    50-99
    2.5842
    100-499
    2.5185
    500-2499
    2.4747
    2500-4999
    2.4200
    5000-9999
    2.3981
    ≥10000
    2.3652
  • 描述: Conn IDC Connector IDT Cable Mount
    9373
    5-49
    27.7875
    50-199
    26.6000
    200-499
    25.9350
    500-999
    25.7688
    1000-2499
    25.6025
    2500-4999
    25.4125
    5000-7499
    25.2938
    ≥7500
    25.1750
  • 描述: 2.00毫米( 0.079 )间距的Milli-电网™线对板插座,双排, IDT ,无铅, 44电路, 0.38毫米( 0.015 ),金(Au )选择性电镀 2.00mm (.079) Pitch Milli-Grid™ Cable-to-Board Receptacle, Dual Row, IDT, Lead-free, 44 Circuits, 0.38mm (.015) Gold (Au) Selective Plating
    6456
    5-49
    26.6409
    50-199
    25.5024
    200-499
    24.8648
    500-999
    24.7055
    1000-2499
    24.5461
    2500-4999
    24.3639
    5000-7499
    24.2501
    ≥7500
    24.1362
  • 描述: 2.00毫米( .079 “ )间距的Milli-网格线对板插座,双排, IDT ,无铅, 50电路 2.00mm (.079") Pitch Milli-Grid Cable-to-Board Receptacle, Dual Row, IDT, Lead-free, 50 Circuits
    5220
    1-9
    44.8350
    10-99
    42.2625
    100-249
    40.3515
    250-499
    40.0575
    500-999
    39.7635
    1000-2499
    39.4328
    2500-4999
    39.1388
    ≥5000
    38.9550
  • 描述: 2.00毫米( 0.079 )间距的Milli-电网™线对板插座,双排, IDT , 44无铅电路, 0.38毫米( 0.015 ),金(Au )选择性电镀 2.00mm (.079) Pitch Milli-Grid™ Cable-to-Board Receptacle, Dual Row, IDT, Leadfree 44 Circuits, 0.38mm (.015) Gold (Au) Selective Plating
    6753
    5-49
    23.5053
    50-199
    22.5008
    200-499
    21.9383
    500-999
    21.7977
    1000-2499
    21.6570
    2500-4999
    21.4963
    5000-7499
    21.3959
    ≥7500
    21.2954
  • 描述: Conn Shrouded Header HDR 12POS 1.5mm Solder RA SMD Embossed T/R
    6217
    5-24
    5.6430
    25-49
    5.2250
    50-99
    4.9324
    100-499
    4.8070
    500-2499
    4.7234
    2500-4999
    4.6189
    5000-9999
    4.5771
    ≥10000
    4.5144
  • 描述: 4.20毫米( 0.165 ),迷你小飞度™接头,直角,耐高温,无法兰, 4回路,锡(Sn )在铜(Cu )镀层,灼热丝兼容 4.20mm (.165) Mini-Fit Jr.™ Header, Right Angle, High Temperature, without Flange, 4 Circuits, Tin (Sn) over Copper (Cu) Plating, Glow Wire Compatible
    4142
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000

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