品牌:
TE Connectivity (泰科)(36)
Samtec (申泰电子)(364)
Molex (莫仕)(15)
Preci-Dip Durtal Sa(5)
Weidmuller (魏德米勒)(6)
3M(2)
FCI Electronics (法马通)(36)
Kyocera (京瓷)(2)
Harwin(1)
Amphenol (安费诺)(33)
多选
封装:
-(10)
Solder(245)
Surface Mount(32)
Through Hole(153)
(46)
6(2)
PCB(2)
29(1)
Board(1)
8(2)
throughHole(3)
2.54 mm(3)
多选
包装:
Box(5)
Bulk(230)
Tape & Reel (TR)(43)
(175)
-(1)
Tube(33)
Tray(11)
Tape(1)
Bag(1)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面贴装兼容 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible
    8694
    10-99
    9.8280
    100-499
    9.3366
    500-999
    9.0090
    1000-1999
    8.9926
    2000-4999
    8.9271
    5000-7499
    8.8452
    7500-9999
    8.7797
    ≥10000
    8.7469
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,无管理单元塑料钉板锁, 16电路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    8160
    1-9
    59.2432
    10-99
    55.8440
    100-249
    53.3189
    250-499
    52.9304
    500-999
    52.5419
    1000-2499
    52.1049
    2500-4999
    51.7164
    ≥5000
    51.4736
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,无管理单元塑料钉板锁, 20电路, 0.38μm ( 15μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating
    8236
    1-9
    58.7918
    10-99
    55.4185
    100-249
    52.9126
    250-499
    52.5271
    500-999
    52.1416
    1000-2499
    51.7079
    2500-4999
    51.3224
    ≥5000
    51.0814
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装, DualRow ,直角,以管理单元塑料钉板锁,8个电路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    5582
    5-49
    24.5583
    50-199
    23.5088
    200-499
    22.9211
    500-999
    22.7742
    1000-2499
    22.6272
    2500-4999
    22.4593
    5000-7499
    22.3544
    ≥7500
    22.2494
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,无管理单元塑料钉板锁, 14电路,锡(Sn )镀层 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 14 Circuits, Tin (Sn) Plating
    1618
    5-49
    34.2693
    50-199
    32.8048
    200-499
    31.9847
    500-999
    31.7797
    1000-2499
    31.5746
    2500-4999
    31.3403
    5000-7499
    31.1939
    ≥7500
    31.0474
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面安装,双排,直角 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle
    7412
    1-9
    39.6134
    10-99
    37.3405
    100-249
    35.6521
    250-499
    35.3923
    500-999
    35.1325
    1000-2499
    34.8403
    2500-4999
    34.5806
    ≥5000
    34.4182
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,以管理单元塑料钉板锁, 12电路, 0.38μm ( 15μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating
    9486
    5-49
    29.1798
    50-199
    27.9328
    200-499
    27.2345
    500-999
    27.0599
    1000-2499
    26.8853
    2500-4999
    26.6858
    5000-7499
    26.5611
    ≥7500
    26.4364
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,以管理单元塑料钉板锁, 10电路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 10 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    8446
    5-49
    28.7235
    50-199
    27.4960
    200-499
    26.8086
    500-999
    26.6368
    1000-2499
    26.4649
    2500-4999
    26.2685
    5000-7499
    26.1458
    ≥7500
    26.0230
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面安装,双排,直角,以管理单元 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in
    7844
    1-9
    62.7900
    10-99
    60.0600
    100-249
    59.5686
    250-499
    59.1864
    500-999
    58.5858
    1000-2499
    58.3128
    2500-4999
    57.9306
    ≥5000
    57.6030
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面安装,双排,直角,以管理单元塑料钉 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg
    6932
    5-49
    25.3305
    50-199
    24.2480
    200-499
    23.6418
    500-999
    23.4903
    1000-2499
    23.3387
    2500-4999
    23.1655
    5000-7499
    23.0573
    ≥7500
    22.9490
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面安装,双排,直角 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle
    4149
    5-49
    28.3959
    50-199
    27.1824
    200-499
    26.5028
    500-999
    26.3330
    1000-2499
    26.1631
    2500-4999
    25.9689
    5000-7499
    25.8476
    ≥7500
    25.7262
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,以管理单元塑料栓锁电路板,电路6 , 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    1540
    5-49
    19.4103
    50-199
    18.5808
    200-499
    18.1163
    500-999
    18.0002
    1000-2499
    17.8840
    2500-4999
    17.7513
    5000-7499
    17.6684
    ≥7500
    17.5854
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面安装,双排,直角,无 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without
    5817
    5-49
    31.8825
    50-199
    30.5200
    200-499
    29.7570
    500-999
    29.5663
    1000-2499
    29.3755
    2500-4999
    29.1575
    5000-7499
    29.0213
    ≥7500
    28.8850
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面贴装兼容,双3.00毫米( 0.118 ” )间距微飞度3.0 BMI ™接头,表面贴装兼容,双 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual
    9962
    5-49
    15.4206
    50-199
    14.7616
    200-499
    14.3926
    500-999
    14.3003
    1000-2499
    14.2080
    2500-4999
    14.1026
    5000-7499
    14.0367
    ≥7500
    13.9708
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,无管理单元塑料栓锁电路板,电路6 , 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 6 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    7719
    5-49
    19.4103
    50-199
    18.5808
    200-499
    18.1163
    500-999
    18.0002
    1000-2499
    17.8840
    2500-4999
    17.7513
    5000-7499
    17.6684
    ≥7500
    17.5854
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,直角,以管理单元塑料钉板锁, 4回路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 4 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    8973
    5-49
    14.2506
    50-199
    13.6416
    200-499
    13.3006
    500-999
    13.2153
    1000-2499
    13.1300
    2500-4999
    13.0326
    5000-7499
    12.9717
    ≥7500
    12.9108
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 BMI头,表面安装,双排,直角 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle
    6343
    10-99
    10.5120
    100-499
    9.9864
    500-999
    9.6360
    1000-1999
    9.6185
    2000-4999
    9.5484
    5000-7499
    9.4608
    7500-9999
    9.3907
    ≥10000
    9.3557
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0头,表面贴装兼容,单列,立式,与PCB偏光钉 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg
    5287
    5-49
    18.0063
    50-199
    17.2368
    200-499
    16.8059
    500-999
    16.6982
    1000-2499
    16.5904
    2500-4999
    16.4673
    5000-7499
    16.3904
    ≥7500
    16.3134
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,直角,用焊片, 11电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,灼热丝兼容 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row,Right Angle, with Solder Tab, 11 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating,Glow Wire Compatible
    7536
    5-49
    23.8212
    50-199
    22.8032
    200-499
    22.2331
    500-999
    22.0906
    1000-2499
    21.9481
    2500-4999
    21.7852
    5000-7499
    21.6834
    ≥7500
    21.5816
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,立式,带焊片, 10电路,锡(Sn )镀层,灼热丝兼容 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 10 Circuits, Tin (Sn) Plating, Glow Wire Compatible
    2568
    5-49
    20.5686
    50-199
    19.6896
    200-499
    19.1974
    500-999
    19.0743
    1000-2499
    18.9512
    2500-4999
    18.8106
    5000-7499
    18.7227
    ≥7500
    18.6348
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,直角,带压入金属固定夹, 10电路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row,Right Angle, with Press-fit Metal Retention Clip, 10 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    9592
    5-49
    22.0662
    50-199
    21.1232
    200-499
    20.5951
    500-999
    20.4631
    1000-2499
    20.3311
    2500-4999
    20.1802
    5000-7499
    20.0859
    ≥7500
    19.9916
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0头,表面贴装兼容,单列,立式,带焊片 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab
    5036
    5-49
    23.8563
    50-199
    22.8368
    200-499
    22.2659
    500-999
    22.1232
    1000-2499
    21.9804
    2500-4999
    21.8173
    5000-7499
    21.7154
    ≥7500
    21.6134
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0头,表面贴装兼容,单列,立式,带焊片, 8电路 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab, 8 Circuits
    4558
    5-49
    21.3291
    50-199
    20.4176
    200-499
    19.9072
    500-999
    19.7796
    1000-2499
    19.6519
    2500-4999
    19.5061
    5000-7499
    19.4150
    ≥7500
    19.3238
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,立式,带焊片, 8回路,锡(Sn )镀层,灼热丝兼容 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab, 8 Circuits, Tin (Sn) Plating, Glow Wire Compatible
    5904
    5-49
    18.7902
    50-199
    17.9872
    200-499
    17.5375
    500-999
    17.4251
    1000-2499
    17.3127
    2500-4999
    17.1842
    5000-7499
    17.1039
    ≥7500
    17.0236
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,直角,用焊片, 9电路,锡(Sn )镀层,灼热丝兼容 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Right Angle, with Solder Tab, 9 Circuits, Tin (Sn) Plating, Glow Wire Compatible
    2592
    5-49
    20.2644
    50-199
    19.3984
    200-499
    18.9134
    500-999
    18.7922
    1000-2499
    18.6710
    2500-4999
    18.5324
    5000-7499
    18.4458
    ≥7500
    18.3592
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0头,表面贴装兼容,单列,立式,带压接 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit
    2998
    5-49
    16.8948
    50-199
    16.1728
    200-499
    15.7685
    500-999
    15.6674
    1000-2499
    15.5663
    2500-4999
    15.4508
    5000-7499
    15.3786
    ≥7500
    15.3064
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,立式,与PCB偏光PEG, 3电路 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 3 Circuits
    4398
    5-24
    5.9400
    25-49
    5.5000
    50-99
    5.1920
    100-499
    5.0600
    500-2499
    4.9720
    2500-4999
    4.8620
    5000-9999
    4.8180
    ≥10000
    4.7520
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,立式,与PCB偏光PEG, 2个电路 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 2 Circuits
    1649
    5-24
    5.1840
    25-49
    4.8000
    50-99
    4.5312
    100-499
    4.4160
    500-2499
    4.3392
    2500-4999
    4.2432
    5000-9999
    4.2048
    ≥10000
    4.1472
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,立式,与PCB偏光PEG, 3电路 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 3 Circuits
    6370
    5-24
    5.9400
    25-49
    5.5000
    50-99
    5.1920
    100-499
    5.0600
    500-2499
    4.9720
    2500-4999
    4.8620
    5000-9999
    4.8180
    ≥10000
    4.7520
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 3.00毫米( 0.118 “ )间距微飞度3.0头,表面贴装兼容,单列,立式,带焊片 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab
    1583
    5-49
    16.3449
    50-199
    15.6464
    200-499
    15.2552
    500-999
    15.1575
    1000-2499
    15.0597
    2500-4999
    14.9479
    5000-7499
    14.8781
    ≥7500
    14.8082

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