品牌:
TE Connectivity (泰科)(36)
Samtec (申泰电子)(364)
Molex (莫仕)(15)
Preci-Dip Durtal Sa(5)
Weidmuller (魏德米勒)(6)
3M(2)
FCI Electronics (法马通)(36)
Kyocera (京瓷)(2)
Harwin(1)
Amphenol (安费诺)(33)
多选
封装:
-(10)
Solder(245)
Surface Mount(32)
Through Hole(153)
(46)
6(2)
PCB(2)
29(1)
Board(1)
8(2)
throughHole(3)
2.54 mm(3)
多选
包装:
Box(5)
Bulk(230)
Tape & Reel (TR)(43)
(175)
-(1)
Tube(33)
Tray(11)
Tape(1)
Bag(1)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装: Solder
    描述: 2.54毫米( .100“ )间距C- Grid®分离针座,薄型,双排,直角,高温, 14电路, 0.38μm ( 15μ ”),金(Au )选择性电镀 2.54mm (.100") Pitch C-Grid® Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating
    2172
    5-49
    27.4131
    50-199
    26.2416
    200-499
    25.5856
    500-999
    25.4216
    1000-2499
    25.2575
    2500-4999
    25.0701
    5000-7499
    24.9530
    ≥7500
    24.8358
  • 品牌: Molex (莫仕)
    封装: Solder
    描述: 2.54毫米( .100“ )间距C- Grid®分离针座,薄型,双排,右AngleHigh温度, 12电路, 0.38μm ( 15μ ”),金(Au )选择性电镀 2.54mm (.100") Pitch C-Grid® Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating
    1361
    5-49
    23.4936
    50-199
    22.4896
    200-499
    21.9274
    500-999
    21.7868
    1000-2499
    21.6462
    2500-4999
    21.4856
    5000-7499
    21.3852
    ≥7500
    21.2848
  • 描述: 1.00毫米( .039 “ )间距夹层插座,表面贴装,双排, VerticalStacking , 84电路 1.00mm (.039") Pitch Mezzanine Receptacle, Surface Mount, Dual Row, VerticalStacking, 84 Circuits
    8727
    1-9
    43.2124
    10-99
    40.7330
    100-249
    38.8912
    250-499
    38.6078
    500-999
    38.3244
    1000-2499
    38.0057
    2500-4999
    37.7223
    ≥5000
    37.5452
  • 描述: 1.00毫米( .039 “ )间距夹层IEEE 1386插座,表面贴装,双排,垂直叠加 1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row, Vertical Stacking
    1514
    1-9
    40.9554
    10-99
    38.6055
    100-249
    36.8599
    250-499
    36.5913
    500-999
    36.3227
    1000-2499
    36.0206
    2500-4999
    35.7521
    ≥5000
    35.5842
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 1.00毫米( .039 )间距夹层IEEE 1386插件,表面贴装,双排,垂直叠加, 64电路, 8.35毫米( 0.329 )未交配高度,没有PCB定位器衣夹 1.00mm (.039) Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, Vertical Stacking, 64 Circuits, 8.35mm (.329) Unmated Height, without PCB Locator Pegs
    5196
    5-49
    34.6554
    50-199
    33.1744
    200-499
    32.3450
    500-999
    32.1377
    1000-2499
    31.9304
    2500-4999
    31.6934
    5000-7499
    31.5453
    ≥7500
    31.3972
  • 描述: 1.00毫米( .039 “ )间距夹层IEEE 1386插件,表面贴装,双排, VerticalStacking , 64电路, 8.35毫米( 0.329 ”没有)未交配高度,与PCB定位螺钉, 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 8.35mm (.329") Unmated Height, with PCB Locator Pegs, without
    8179
    1-9
    57.5230
    10-99
    54.2225
    100-249
    51.7707
    250-499
    51.3935
    500-999
    51.0163
    1000-2499
    50.5920
    2500-4999
    50.2148
    ≥5000
    49.9790
  • 描述: 1.00毫米( .039 “ )间距夹层IEEE 1386插件,表面贴装,双排, VerticalStacking , 64电路, 7.35毫米( 0.289 ”没有)未交配高度,与PCB定位螺钉, 1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 7.35mm (.289") Unmated Height, with PCB Locator Pegs, without
    8022
    1-9
    42.5536
    10-99
    40.1120
    100-249
    38.2982
    250-499
    38.0192
    500-999
    37.7402
    1000-2499
    37.4262
    2500-4999
    37.1472
    ≥5000
    36.9728
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded36电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,用压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded36 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, with Press-fit Plastic Pegs
    8254
    1-9
    64.1815
    10-99
    61.3910
    100-249
    60.8887
    250-499
    60.4980
    500-999
    59.8841
    1000-2499
    59.6051
    2500-4999
    59.2144
    ≥5000
    58.8796
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直,带罩, 8Circuits , 0.76μm ( 30μ ”),金(Au )选择性电镀,用压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, with Press-fit Plastic Pegs
    5053
    5-49
    32.4792
    50-199
    31.0912
    200-499
    30.3139
    500-999
    30.1196
    1000-2499
    29.9253
    2500-4999
    29.7032
    5000-7499
    29.5644
    ≥7500
    29.4256
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded34电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,用压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded34 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, with Press-fit Plastic Pegs
    2675
    1-9
    61.9620
    10-99
    59.2680
    100-249
    58.7831
    250-499
    58.4059
    500-999
    57.8132
    1000-2499
    57.5438
    2500-4999
    57.1667
    ≥5000
    56.8434
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直,带罩, 8Circuits , 0.38μm ( 15μ ”),金(Au )选择性电镀,用压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 8Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, with Press-fit Plastic Pegs
    7009
    5-49
    23.7042
    50-199
    22.6912
    200-499
    22.1239
    500-999
    21.9821
    1000-2499
    21.8403
    2500-4999
    21.6782
    5000-7499
    21.5769
    ≥7500
    21.4756
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded60电路,锡(Sn )镀层,用压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded60 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
    8404
    1-9
    110.5265
    10-99
    105.7210
    100-249
    104.8560
    250-499
    104.1832
    500-999
    103.1260
    1000-2499
    102.6455
    2500-4999
    101.9727
    ≥5000
    101.3961
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded20电路,锡(Sn )电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded20 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
    2412
    5-49
    23.9148
    50-199
    22.8928
    200-499
    22.3205
    500-999
    22.1774
    1000-2499
    22.0343
    2500-4999
    21.8708
    5000-7499
    21.7686
    ≥7500
    21.6664
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded40电路, 0.76μm ( 30μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    7797
    1-9
    97.4280
    10-99
    93.1920
    100-249
    92.4295
    250-499
    91.8365
    500-999
    90.9046
    1000-2499
    90.4810
    2500-4999
    89.8879
    ≥5000
    89.3796
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直,带罩, 6Circuits , 0.76μm ( 30μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 6Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    5443
    5-49
    34.8777
    50-199
    33.3872
    200-499
    32.5525
    500-999
    32.3439
    1000-2499
    32.1352
    2500-4999
    31.8967
    5000-7499
    31.7477
    ≥7500
    31.5986
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,缭绕, 8电路, 0.76米( 30” ) 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 8 Circuits, 0.76m (30")
    6826
    1-9
    38.4178
    10-99
    36.2135
    100-249
    34.5760
    250-499
    34.3241
    500-999
    34.0722
    1000-2499
    33.7888
    2500-4999
    33.5369
    ≥5000
    33.3794
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded50电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded50 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    2853
    1-9
    77.7400
    10-99
    74.3600
    100-249
    73.7516
    250-499
    73.2784
    500-999
    72.5348
    1000-2499
    72.1968
    2500-4999
    71.7236
    ≥5000
    71.3180
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded24电路,锡(Sn )镀层,用压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded24 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
    8640
    1-9
    42.7244
    10-99
    40.2730
    100-249
    38.4520
    250-499
    38.1718
    500-999
    37.8916
    1000-2499
    37.5765
    2500-4999
    37.2963
    ≥5000
    37.1212
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,罩, 6电路,锡(Sn )镀层,用压入塑料钉 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 6 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
    2239
    5-49
    18.5328
    50-199
    17.7408
    200-499
    17.2973
    500-999
    17.1864
    1000-2499
    17.0755
    2500-4999
    16.9488
    5000-7499
    16.8696
    ≥7500
    16.7904
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded20电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    4690
    5-49
    32.6664
    50-199
    31.2704
    200-499
    30.4886
    500-999
    30.2932
    1000-2499
    30.0978
    2500-4999
    29.8744
    5000-7499
    29.7348
    ≥7500
    29.5952
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,罩, 14电路, 0.38米 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 14 Circuits, 0.38m
    2834
    1-9
    40.5772
    10-99
    38.2490
    100-249
    36.5195
    250-499
    36.2534
    500-999
    35.9873
    1000-2499
    35.6880
    2500-4999
    35.4219
    ≥5000
    35.2556
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,罩, 26电路, 0.38米 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 26 Circuits, 0.38m
    6611
    1-9
    58.6698
    10-99
    55.3035
    100-249
    52.8028
    250-499
    52.4181
    500-999
    52.0334
    1000-2499
    51.6006
    2500-4999
    51.2159
    ≥5000
    50.9754
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直, Shrouded10电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded10 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    4709
    5-49
    30.4785
    50-199
    29.1760
    200-499
    28.4466
    500-999
    28.2643
    1000-2499
    28.0819
    2500-4999
    27.8735
    5000-7499
    27.7433
    ≥7500
    27.6130
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C-网格标题,表面贴装,双排,垂直,罩, 16电路,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 16 Circuits, Tin (Sn) Plating
    6224
    1-9
    39.2596
    10-99
    37.0070
    100-249
    35.3336
    250-499
    35.0762
    500-999
    34.8188
    1000-2499
    34.5291
    2500-4999
    34.2717
    ≥5000
    34.1108
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100“ )间距C- Grid®头,表面贴装,双排,垂直,带罩, 6Circuits ,锡(Sn )电镀,无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 6Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
    4840
    5-49
    26.4069
    50-199
    25.2784
    200-499
    24.6464
    500-999
    24.4885
    1000-2499
    24.3305
    2500-4999
    24.1499
    5000-7499
    24.0371
    ≥7500
    23.9242
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: Conn Shrouded Header HDR 10POS 2.54mm Solder ST Thru-Hole Tube
    4759
    5-49
    15.4908
    50-199
    14.8288
    200-499
    14.4581
    500-999
    14.3654
    1000-2499
    14.2727
    2500-4999
    14.1668
    5000-7499
    14.1006
    ≥7500
    14.0344
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”口袋,带罩,带压入塑料钉, 8电路, 0.76μm ( 30μ “),金(Au )选择性电镀,锡( Sn)的PC端脚镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
    8682
    5-49
    19.9017
    50-199
    19.0512
    200-499
    18.5749
    500-999
    18.4559
    1000-2499
    18.3368
    2500-4999
    18.2007
    5000-7499
    18.1157
    ≥7500
    18.0306
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”掌上, Shroudedwith压入塑料栓, 16电路, 0.76μm ( 30μ “),金(Au )选择性电镀,锡 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 16 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin
    4670
    5-49
    33.9534
    50-199
    32.5024
    200-499
    31.6898
    500-999
    31.4867
    1000-2499
    31.2836
    2500-4999
    31.0514
    5000-7499
    30.9063
    ≥7500
    30.7612
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”掌上, Shroudedwith压入塑料栓, 20电路, 0.38μm ( 15μ “),金(Au )选择性电镀,锡 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin
    1980
    1-9
    66.2055
    10-99
    63.3270
    100-249
    62.8089
    250-499
    62.4059
    500-999
    61.7726
    1000-2499
    61.4848
    2500-4999
    61.0818
    ≥5000
    60.7364
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”口袋,带罩,带压入塑料钉, 5电路, 0.38μm ( 15μ “),金(Au )选择性电镀,锡( Sn)的PC端脚镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded,with Press-fit Plastic Peg, 5 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin(Sn) PC Tail Plating
    8881
    10-99
    10.9680
    100-499
    10.4196
    500-999
    10.0540
    1000-1999
    10.0357
    2000-4999
    9.9626
    5000-7499
    9.8712
    7500-9999
    9.7981
    ≥10000
    9.7615

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