Process Capability_Multilayer PCB Manufacturing Expert

Process capability

Tallest layer number Sixteen Batch processing capacity 1-12 layers, sample processing capacity 1-16 layers
surface treatment Carbon oil, tin spraying, lead-free tin spraying, gold precipitation, silver precipitation, OSP, gold finger, selective gold precipitation, gold plating, HAL
Plate thickness range 0.4-3.5mm Conventional plate thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm; the thickest plate thickness in large quantities can be processed to 3.5
Tolerance of Board Thickness
T≥1.0mm ±10% For example, the plate thickness T = 1.6 mm and the physical plate thickness 1.44 mm (T-1.6)×10%)~1.76mm(T+1.6×10%)
Tolerance of Board Thickness
T<1.0mm ±0.1mm 比如板厚T=0.8mm，实物板厚为0.7mm(T-0.1)~0.9mm(T+0.1)
Plate type FR-4, high frequency board, Rogers, FR4 board use Jiantao A grade material on both sides, multi-layer board use Shenyi A grade material, high TG.

Minimum half hole diameter 0.5mm Half-hole process is a special process, the minimum aperture should not be less than 0.5mm.
Minimum pore size
Mechanical drill 0.2mm Conditions permit recommended designs of 0.3mm or more, with aperture tolerances of 0.3mm or more.±0.075mm
Minimum slot aperture
Mechanical drill 0.6mm The tolerance of groove aperture is±0.1mm
Minimum pore size
Laser drill 0.1mm The tolerance of laser drilling is±0.01mm
Minimum hole spacing
Mechanical drill ≥0.2mm Minimum hole spacing for mechanical drilling≥0.2mm, different network spacing≥0.25mm
Stamp aperture diameter 0.5mm Stamp holes are 0.25mm apart, added in the middle of the outer frame, the minimum number of holes arranged needs to be≥3
Aperture of plug hole ≤0.6mm Over 0.6mm Surface Pad Cover Oil
Through hole single side welding ring 4mil Via is 4mil minimum and device hole is 6mil minimum. Increasing through-hole welding ring is helpful for over-current.

Stripping strength ≥2.0N/cm
Flame retardancy 94V-0
Impedance type Single ended differential
Coplanar (single-ended, differential) Single-ended or coplanar single-ended impedance controllable: 45-85 Euros, differential or coplanar differential impedance controllable: 85-110 Euros
Special technology Resin Plug Hole, Plate Hole, Mixed Plate, PTFE, Blind Buried Hole, Binding IC

Pads software Copper in Hatch way
Minimum filler pad Reduction copper paving is used in the factory.
Minimum D code for minimum custom pad filling should not be less than 0.0254 mm
Protel 99SE Special D codes
Extragalactic object D code is easy to be replaced or lost in data conversion process, which causes data problems.
Placing components far away from the PCB board, the conversion process can not be output due to too large size boundary.
Altium Designer Version problem
Font problem Please specify the version number of the software used.
Special fonts are easily replaced by other fonts in the process of opening file conversion
Protel/dxp
Windowing layer in software Solder level Please do not misplace it in the paste layer. This PCB factory does not deal with the paste layer.

Minimum line width ≥3/3mil
(0.076mm) 4/4mil (finished copper thickness 1oz), 5/5MIL (finished copper thickness 2oz), 8/8mil (finished copper thickness 3oz), conditions permit recommendation to increase line width and line spacing
Minimum Network Width Line Spacing ≥6mil/8mil
(0.15/0.20mm) 6/8mil (finished copper thickness 1oz), 8/10mil (finished copper thickness 2oz), 10/12mil (finished copper thickness 3oz)
Minimum etched font width ≥8mil
(0.20mm) 8mil (finished copper thickness 1oz), 10mil (finished copper thickness 2oz), 12mil (finished copper thickness 3oz)
Minimum BGA, Bonding Pad ≥6mil
(0.15mm) For example, the plate thickness T = 1.6 mm and the physical plate thickness 1.44 mm (T-1.6)×10%)~1.76mm(T+1.6×10%)
Copper thickness of finished product 35-140 μm Refers to the thickness of copper foil on the outer circuit of finished circuit boards
Inner copper thickness of finished product 17-70um Refers to the widths of two copper sheets in a circuit.
Distance between alignment and shape ≥10mil
(0.25mm) When Gong plate is shipped, the distance between the line and the shape line of the plate should be greater than 0.25 mm; when V-splitting plate is shipped, the distance between the line and the center line of V-splitting should be greater than 0.35 mm; when special pad requirements are tangent to the shape, copper exposure on the side of the pad should be accepted.

Minimum character width ≥0.6mm Character minimum width, if less than 0.6mm, physical board may cause character ambiguity due to design reasons
Minimum character height ≥0.8mm Character minimum height, if less than 0.8mm, physical board may be due to design reasons for character ambiguity
Minimum character line width ≥5mil Character minimum line width, if less than 5 mil, physical board may cause character imprint due to design reasons
Patch Character Box Distance Resistance Welding Spacing ≥0.2mm If the distance between the patch character frame and the welding resistance is less than 0.2mm, when the character is removed after the window is opened, the width of the character frame is insufficient, which leads to poor silk printing.
Character aspect ratio 1:6 The most suitable ratio of width to height is more conducive to production.

Solder resist type Photosensitive ink White, black (bright, matte), blue, green, yellow, red, etc.
Solder resist Bridge Green oil ≥0.1mm
Variegated oil ≥0.12mm
Black and white oil ≥0.15mm In order to fabricate resistance bridges, the design spacing of pads is more than 0.18. The thicker the copper, the bigger the spacing. Special devices (e.g. triodes) allow resistance welding to slightly mount PAD or print character white oil blocks.

Minimum slot knife 0.60mm The minimum width of copper groove in the plate is 0.60 mm and that of non-brass Gong groove is 0.6.
Maximum size 550mm x 560mm This PCB factory is only allowed to accept 500 mm x 500 mm for the time being. Please contact customer service in special cases.
V-CUT Strike length ≥ 55mm
Strike width ≤ 380mm 1. V-CUT strike length refers to the length from the end of the V-CUT line to the non-point.
2. V-CUT strike width refers to the plate width perpendicular to V-CUT

No gap 0mm gap spelling It's a patchwork shipment. The gap between the middle plate and the plate is 0.
Gap > 1.6mm The clearance of patchwork with clearance should be greater than 1.6 mm, otherwise it will be more difficult when the edge of Gong is used.
Half-orifice plate assembly rules 1. One or two half orifices are connected by V-CUT or stamps.
2. Three-sided or four-sided half-orifice plates are assembled with four corners and connecting bits.
Multiple shipments A viable V-CUT or stamp hole connection is required for multiple combined shipments.